EMI AND ENCLOSURE DESIGN
November 1st, 2007 by Editor
EMI/RFI shielding is an important concept with regards to both the electronic engineer and the enclosure designer. At NEDC Fabricating Solutions we recognize both aspects of the process. The electronic engineer must always consider EMC when thinking about the layout and the circuit design when attempting to limit or eliminate the majority of EMC emissions. Often the design for which the electronic engineer puts forth may not be sufficient to attenuate emissions to the required levels and shielding of the enclosure may be necessary. Of primary importance to the designer is the specific thought to the placement of screening gaskets at joint surfaces. Enclosures may be made from any material provided that it is conductive. Metallic enclosures intrinsically have this characteristic. Plastic enclosures, which are in widespread use, need to also be conductive which can be obtained using conductive paint, electroplating, or vacuum metallization. More often than not these enclosures are not just a simple screened box and may have openings for such purposes as optical design, ventilation, and cable entries. Surface-mount gaskets, gaskets in grooves, flange/gasket conduction, as well as corrosion all have to enter the thought process in the design of these enclosures. Because we here at NEDC have had many years of die cutting and EMI shielding experience we feel we can assist you in all your specific design application needs. Call us at 1-800-224-6332 with any need you may have. We can also be seen at www.nedc.com